Details: Most Powerful MediaTek Helio X30 Chipset Using 10nm Deca-Core SoC With Up To 8GB RAM And Helio P25 Announced


With the official announcement of MediaTek’s flaghsip Melio X30 Deca-Core processor at an event in China, MediaTek also detailed its specifications and hardware efficiency and more. As it was using 10nm TSMC process ad replaced two ARM Cortex-A72 cores in the X20 with ARM Cortex-A73 cores clocked at 2.8GHz.

The CPU design on the MediaTek Helio X30 is quite a piece of work, despite its being smaller number, the X30 chipset is the higher-end offering between the two and in an attempt to find a place beside Qualcomm and Samsung’s Snapdragon and Exynos processors, MediaTek’s new Helio X30 application processor has at least ten cores now, with a pair of Cortex-A73 cores maxing out when handling all the intensive processing chores. Clock speeds of other eight ARM Cortex-A53 cores have also been increased. While the X30 Deca-Core promises a 53% improved power savings and 43% better performance than the X20 process. Additionally, it now supports LPDDR4 RAM up to 8GB memory chips and almost 28-megapixel dual ISPs.

Four 2.2GHz Cortex-A53 cores will be the backup muscle, and the other four low-power Cortex-A35 2GHz cores will handle everyday, menial tasks. With that said, the Helio X30 chipset can undoubtedly hand up to 8GB of RAM, and will of course, be paired with a quad-core PowerVR graphics unit (GPU). It’s said to be able to far beyond supports Google’s DyaDream VR demands without missing a beat.

Now that it’s been clear that, instead of using Mali-T880 GPU found in the X20, the Helio X30 using Quad-core PowerVR 7XT series that eventually promises 2.4-times better performance and 58-percent improved power saving altogether. MediaTek is mulling over the possibility of another 10nm SoC range that will apparently see action in devices that hover just below the flagships.

It is also said that the Chinese chip manufacturer MediaTek working alongside fab TSMC to create two moile chipsets that will make use of TSMC’s 10nm process and been identified as the Helio X30 and the Helio X35. MediaTek also jions Apple in the hallowed club of TSMC customers that have used the 10nm fabrication process. Volume production of the Helio X30 and X35 chips are expected to kick off by the end of this year 2016 or start early 2017 at the latest.


Comparison Chart: Check out

  X20 X30
Process 20nm 10nm
Apps CPU 2x Cortex-A72 @ 2.1GHz ~ 2.3GHz
4x Cortex-A53 @ 1.85GHz
4x Cortex-A53 @ 1.4GHz
2x Cortex-A73 @ 2.8GHz
4x Cortex-A53 @ 2.2GHz
4x Cortex-A53 @ 2GHz
Memory 2x 32-bit LPDDR3 (Max 4GB) 933MHz up to
4GB eMMC 5.1
4 x 16-bit LPDDR4 (Max 8GB) 1866MHz up to
4GB, eMMC 5.1, UFS 2.1
Camera 25MP @ 30 fps (Dual ISP) 28MP @ 30 fps (Dual ISP) 14 bit Vision processor @ 550 Mhz
Video Decode 4Kx2K 10 bit 30fps H.264/265/VP9 4Kx2K 10 bit 30fps H.264/265/VP9
Video Encode 4Kx2K 30fps H.265 w/HDR 4Kx2K 30fps H.265 w/VP9
Graphics ARM Mali-T880 MP4 700MHz IMG 7XTP-Mt4 820MHz
Display WQXGA 2560×1600 60fps
FHD 1920×1080 120fps
w/12 HW Blending Layer
WQXGA 2560×1600 60fps
FHD 1920×1080 120fps
w/12 HW Blending Layer
Audio 110dB SNR & -95dB THD 120dB SNR & -100dB THD (MT6337) Audio DSP Cortex-M4 420 Mhz
Sensor Processor Cortex-M4 364MHz Cortex-M4 420MHz
Modem LTE FDD/TDD R11 Cat-6 with 2x CA LTE FDD/TDD R12 Cat. 10 with 3x DL CA
Connectivity Integrated Wi-Fi 802.11ac GPS/Glonass/Beidou ANT+, BT/FM External 2 x2 11 ac
Integrated Wi-Fi 802.11ac GPS/Glonass/Beidou ANT+, BT/FM

After introducing Helio X30 10nm Deca-Core SoC, MediaTek also unveiled Helio P25, which is an upgraded version of the Helio P20. This particular uses the same 16nm TSMC process, but it will be clocked at a slightly faster processing unit than when compared to P20. The company however, doesn’t detailed much about the P25 as yet.


Finally, the MediaTek Helio X30 will enter mass production in the first half of next year or by the end of this year.