A leaker outed the information that suggests the upcoming Snapdragon 855 will be the first commercially-available 7nm chipset which Qualcomm is expected to announce it in the near future. Earlier this week, Qualcomm has also introduced Snapdragon X24, the world’s first LTE modem with up to 2Gbps download speeds and as the successor to the Snapdragon X20 that can be used in the Snapdragon 845 10nm SoC. Here are the details you need to know about.
The Snapdragon 845 chip is forayed for Samsung Galaxy S9, which is the South Korea firm’s smartphone ready to hit the store shelves this month. Because, it is the second generation 10LPP processor manufactured by Samsung, Snapdragon 845 SoC is said to be one coming integrated inside the Galaxy S9 and S9+. But according to a new report, TSMC will be making the 7nm (FinFET) chips for the Snapdragon 855 SoC.
Samsung Galaxy S10 rumored to get the Qualcomm’s Snapdragon 855 chipset as well. That theory is based on a comment made by a Qualcomm contractor who claimed to be working on just such a chip. In fact, a 7nm chipset would be faster and use less power than the 10nm chips, which the currently available flagship devices have. When compared, the 7nm is not only faster but also becoming a big news for the mobile industry.
According to the leaker, the upcoming Qualcomm Snapdragon chipset, called the Snapdragon 855 (SDM855), will be the very first commercially-released 7-nanometer processor, which it refers to the half-pitch measurement of nodes in a chip. In other words, if you were to measure the amount of space between a node and its closest node neighbor, and the measurement was 14 nanometers, you would have yourself a half-pitch of 7nm.
Because nodes will be ever-so-slightly closer together on a 7nm chip, the processor will be denser and thus able to be faster while using less power. So we could see 7nm chipsets in flagship mobile devices as early as 2019. But again, as with any leak, information needs to be taken with a pinch of salt.
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Samsung also announced that it’s been working on 7LPP ( Low Power Plus) with EUV (extreme ultraviolet) lithography technology for its smartphones that is aimed for initial production in the second half of 2018. Then this report also claims that Qualcomm is in touch with TSMC since the fab uses normal steppers while Samsung is looking forward with 7nm EUV lithography technology which is somewhat a riskier factor, and which may not be ready on time.
Other specs and features that the first-gen 7nm process involves is a deep ultraviolet (DUV) lithography which is expected to arrive in the second half of this year, with 2nm Gen 2 and Gen 2 involving DUV + EUV lithography are expected next year.
For now, this is it. It’s unclear where the leaker pulled the text from that claims the Snapdragon 855 will be the first 7nm chip. Also, the image he posted doesn’t otherwise say anything about the timelines or system capabilities, only, it merely says the SD855 will be a 7nm chip.
Still, 7nm technology will be a big boost for the smartphone industry, which is capable to give us faster processing with much less power consumption, which is very much exciting. Stay tuned for more updates, soon!
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