Qualcomm Snapdragon X50 5G Modem With Up To 5Gbps Download Speeds Announced And More

Qualcomm has announced Snapdragon 653, 626 and 427 chipsets at the Qualcomm 2016 4G/5G Summit in Hong Kong. Also introduced X50 5G modem at the keynote event, which utilizes wide bandwidths available in the 28 GHz millimeter range (mmWave) band merged with advanced signal processing technologies. Before we go directly talk about the Qualcomm X50 4G modem, should also detail about what the new Snapdragon 653, 626 and 427 SoCs are designed for. Here are the details.

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Key Features And Highlights

All the three Qualcomms Snapdragon 653 has support for up to 8GB of RAM. Both the SD626 and Snapdragon 427 have Qualcomm TruSignal antenna boost to improve signal reception in congested areas, making voice and data connections more reliable and relatively superior quality. All of the Qualcomm SoCs comes equipped with Snapdragon X9 LTE modem for 50% faster upload speeds than X8 LTE chips, Qualcomm Quick Charge 3.0 technology and Dual camera support.

With X9 LTE modem, Quick Charge 3.0 support
Qualcomm Snapdragon 653 (8976Pro) Chip

  • Octa-Core – Quad 1.95GHz A72 + Quad 1.44GHz A53 CPUs
  • 28nm HPm process
  • Memory: Up to 8GB, 2x 32-bit at 933MHz LPDDR3 14.9GB/s
  • Integrated X9 LTE, with Global Mode LTE FDD, LTE TDD, WCDMA (DC-HSPA+, DC-HSUPA), CDMA1x, EV-DO, TD-SCDMA and GSM/EDGE
  • Cat 7 speeds of up to 300 Mbps down via 2×20 MHz carrier aggregation in the downlink and Cat 13 speeds of up to 150 Mbps uplink via 64-QAM
  • Support for LTE Broadcast, LTE Dual SIM, VoLTE, Wi-Fi calling with LTE call continuity, HD and Ultra HD Voice (EVS)
  • Qualcomm Adreno 510 GPU
  • Supports up to Quad High Definition (2560×1600) displays
  • Dual ISPs can support up to 21MP ZSL
  • 4K capture at 30fps, 1080p at 120fps, Hardware HEVC (H.265) encode and decode
  • Miracast support for up to 1080p wireless display
  • Dual-band 802.11ac with MU-MIMO 1×1, Qualcomm IZat Gen8C and Bluetooth 4.1 LE solutions
  • Quick Charge 3.0

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Qualcomm Snapdragon 626 (8953Pro) SoC

  • Octa-Core – Quad 2GHz / 2.2GHz A53 + Quad 2GHz / 2.2GHz A53 CPUs
  • 14 nm LPP process
  • Memory: 1x 32-bit at 933MHz LPDDR3 7.46GB/s, Storage: eMMC 5.1
  • Integrated X9 LTE, with Global Mode LTE FDD, LTE TDD, WCDMA (DC-HSPA+, DC-HSUPA), CDMA1x, EV-DO, TD-SCDMA and GSM/EDGE
  • Cat 7 speeds of up to 300 Mbps down via 2×20 MHz carrier aggregation in the downlink and Cat 13 speeds of up to 150 Mbps uplink via 64-QAM
  • Support for LTE Broadcast, LTE Dual SIM, VoLTE, Wi-Fi calling with LTE call continuity, HD and Ultra HD Voice (EVS)
  • Qualcomm TruSignal Antenna Boost
  • Qualcomm Adreno 506 GPU
  • Supports up to WUXGA (1920×1200) displays
  • Dual ISPs can support up to 24MP
  • 4K capture at 30fps, Hardware HEVC (H.265) encode and decode
  • Miracast support for up to 1080p wireless display
  • Dual-band 802.11ac with MU-MIMO 1×1, Qualcomm IZat Gen8C and Bluetooth 4.1 LE solutions
  • Quick Charge 3.0

Qualcomm Snapdragon 427 (8920) SoC

  • Up to 1.4GHz Quad-Core ARM Cortex A53 CPUs
  • 28 nm LP process
  • Memory: 667MHz LPDDR3, Storage: eMMC 5.1
  • Integrated X9 LTE, with Global Mode LTE FDD, LTE TDD, WCDMA (DC-HSPA+, DC-HSUPA), CDMA1x, EV-DO, TD-SCDMA and GSM/EDGE
  • Cat 7 speeds of up to 300 Mbps down via 2×20 MHz carrier aggregation in the downlink and Cat 13 speeds of up to 150 Mbps uplink via 64-QAM
  • Support for LTE Broadcast, LTE Dual SIM, VoLTE, Wi-Fi calling with LTE call continuity, HD and Ultra HD Voice (EVS)
  • Qualcomm TruSignal Antenna Boost
  • Qualcomm Adreno 308 GPU
  • Supports up to WXGA (1280×800) displays
  • Dual ISPs can support up to 16MP
  • 1080p capture at 30fps, Hardware HEVC (H.265) encode and decode
  • Miracast support for up to 720p wireless display
  • Dual-band 802.11ac with MU-MIMO 1×1, Qualcomm IZat Gen8C and Bluetooth 4.1 LE solutions
  • Quick Charge 3.0

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By the way, the Snapdragon 653 and 626 processors are expected to go live later this year, and devices powering the Snapdragon 427 SoC are said to be available sometime next year.

About Qualcomm Snapdragon X50 5G modem

The newly announced Qualcomm X50 5G Modem can be paired with a Snapdragon processor which comes with an integrated Gigabit LTE modem and can seamlessly work together with it through dual connectivity.

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Additionally, with supporting 4G LTE and mmWave 5G, the X50 modem is a complete 4G/5G multi-mode platform, which is designed to provide dual-connections to both (mobile devices to connect simultaneously over both generations of technology) to achieve extreme mobility between the two.

The X50 5G modem by far can connect using almost 800MHz of bandwidth via 8x100MHz carrier aggregation. Using advanced multiple inputs/inputs (MIMO) techniques like adaptive beam-forming and beam tracking, the Snapdragon X50 5G modem can expand its range of mmWave transmissions to non-line-of-sight scenarios, and also support mobility.

Qualcomm’s Snapdragon X50 5G modem will be tested in the second half of 2017, and the first products with that can be expected in 2018.

Cristiano Amon, executive vice president, Qualcomm Technologies, Inc., and president, QCT said,

The Snapdragon X50 5G modem heralds the arrival of 5G as operators and OEMs reach the cellular network and device testing phase. Utilizing our long history of LTE and Wi-Fi leadership, we are thrilled to deliver a product that will help play a critical role in bringing 5G devices and networks to reality.  This shows that we’re not just talking about 5G, we’re truly committed to it.

(Source: 1, 2)

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