LeTV Le 2 Specs Leaked Ahead Of Launch Date On April 20, Details FHD Display, Helio X20 Chip, 16MP Camera

The successor to LeEco Le 1s has been spotted once again, this time LeEco Le 2 smartphone has been appeared on TENAA along with photos and specifications chart. LeEco is hosting an event in China, where it is expected to take the wraps off the new Le 2 smartphone. Last week, a new benchmarking site detailed its hardware keys and today the upcoming Le 2 smartphone has been spotted at Chinese telecom regulator, giving us its first glimpse at the possible design as well as its features and specs.

It seems like the new phone hint at a design that is quite different from the leaks we have come across earlier. The back of the Le 2 looks pretty similar to what the LeEco Le Max Pro shows up, but featuring a metallic body with antenna lines at top and bottom. The rear camera of the leaked Le 2 phone comes with a fingerprint scanner placed underneath, while the smartphone is said to measure in at 151.1×74.1×7.7mm and weighs 153 grams.

As per the listing, the LeEco Le 2 sports a 5.5-inch 1080p display, is powered by a 2.3GHz MediaTek Helio X20 deca-core processor, a 3GB of RAM. It also includes 32GB of internal storage, may packa 16MP camera on its back and an 8-megapixel on its front, and carrying a 3,000mAh battery on-board. Connectivity options like dual-SIM card slots, 4G LTE support, and USB Type-C port also present.

Earlier reports also suggested that the Le 2 will be powered by MediaTek’s Helio X25 chispet, but mentioned on TENAA makes more sense though, since the X25 Helio SoC is believed to be an Meizu Pro 6 exclusive, expected to be launching in May boasting 6GB of RAM memory, like Vivo Xplay 5.

The LeEco Le 2 smartphone launch is close enough, as the China-based manufacturer is holding an event on April 20 in Beijing, unveil is imminent.

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