Today’s tech gadgets alongside desktop PCs or smartphones and tablets runs on its best SoCs and IBM said that it had made working versions of ultra-dense computer chipsets, with roughly four times the capacity of current most powerful silicon chips. Smaller but more powerful, and it got the ability to squeeze ever more processing power into the same small CPUs is a result of shrinking the fundamental transistors that make up chips. How’s that? Check it out below!
IBM has made the announcement on behalf of an international consortium led by the giant computer company, is part of an affort to manufacture the most advanced computer chips in New York’s Husdon Valley, where IBM is investing a mere $3 billion n a private-public partnership with NY State, GlobalFoundries, Samsung and equipment vendors.
Today the industry is making the commercial transition from what the industry generally describes as 14-nanometer manufacturing to 10-nanometer manufacturing. Each generation brings roughly a 50 percent reduction in the area required by a given amount of circuitry. Although, the IBM’s new chips are still in a reasearch phase, suggest that semiconductor technology will continue to shrink at least through 2018.
The company also said to be working on samples of chips with seven-nanometer transistors. It made the research advance by using silicon-germanium instead of pure silicon in key regions of the molecular-size switches.
The new material used to build the IBM’s new chipsets make possible faster transistor switching and lower power requirements. The tiny size of these transistors suggests that further advances will require new materials and new manufacturing techniques. Indeed, IBM suggest that would make it possible to build microprocessors with more than 20 billion transistors which should be a possibility—about four times that of today’s best chips. As points of comparison to the size of the seven-nanometer transistors, a strand of DNA is about 2.5 nanometers in diameter and a red blood cell is roughly 7,500 nanometers in diameter.
It remains to be seen if the silicon-germanium will be embraced by the chip industry and suggests that it could be safe, at least until 2018.
Reports from The New York Times